Safe & Reliable Large Glass Transfer
Engineered to ensure maximum stability and zero-slip handling during the high-speed transfer of large-generation glass substrates (TFT-LCD, OLED, and semiconductor advanced packaging).
Precision Tooling & Advanced Materials for High-Tech Manufacturing
Advanced Solution for Ultra-Thin & Large-Scale Glass Substrate Transfer
Ultra-thin & large-scale glass substrate transfer for TFT-LCD, OLED, and semiconductor advanced packaging.
Engineered to ensure maximum stability and zero-slip handling during the high-speed transfer of large-generation glass substrates (TFT-LCD, OLED, and semiconductor advanced packaging).
Custom-formulated elastomeric materials and structural designs engineered specifically for ultra-thin glass. Prevents micro-cracks, surface staining, and localized stress concentration during vacuum chucking and mechanical gripping.
Tight-tolerance machining and advanced material bonding for consistent dimensional accuracy across all glass handling tools.
Extended service life through proprietary elastomeric formulations and wear-resistant surface treatments.
High-precision contact pads optimized for robot end-effectors and automated transfer arms.
Precision-engineered & durable rollers designed for continuous line transfer